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Optimizing of process parameter and further step coverage improving regarding copper seed deposition for 50nm NAND flash | Semantic Scholar
Effect of substrate on the step coverage of plasma-enhanced chemical-vapor deposited tetraethylorthosilicate films
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Enhanced Step Coverage of TiO2 Deposited on High Aspect Ratio Surfaces by Plasma-Enhanced Atomic Layer Deposition | Langmuir
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Coatings | Free Full-Text | Optical Constant and Conformality Analysis of SiO2 Thin Films Deposited on Linear Array Microstructure Substrate by PECVD
Study of the step coverage and contact resistance by using two-step TiN barrier and evolve simulation
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The illustration of evolution of step coverage profiles (light blue) of... | Download Scientific Diagram
![Enhanced Step Coverage of TiO2 Deposited on High Aspect Ratio Surfaces by Plasma-Enhanced Atomic Layer Deposition | Langmuir Enhanced Step Coverage of TiO2 Deposited on High Aspect Ratio Surfaces by Plasma-Enhanced Atomic Layer Deposition | Langmuir](https://pubs.acs.org/cms/10.1021/acs.langmuir.5b00216/asset/images/large/la-2015-00216e_0004.jpeg)
Enhanced Step Coverage of TiO2 Deposited on High Aspect Ratio Surfaces by Plasma-Enhanced Atomic Layer Deposition | Langmuir
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